Step by step: Bottom hole

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Hands-on design training for MultiMEMS
D. Lapadatu and P. Ohlckers

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| 7.1 Step by step: Bottom hole

In this exercise we will draw the masks for glass etch of a hole in the backside glass. We will use the two backside glass etch mask layers:

- BOGEB
- BOGEF

BOGEF

- The BOttom side Glass ETch Frontside mask governs the openings for the glass etch on side of the bottom glass facing the silicon sensor part. It means that features on this mask will result in cavities on the inside of the bottom glass.
- Minimum linewidth is 180 microns
- Add a circle of half the minimum linewidth or larger in the centre of the cell (See illustration to the right)

BOGEB

- Similar to BOGEB, the BOttom Glass ETch Backside mask governs the opening in the masking layer for the etching of the backside of the bottom glass. This means the outside of the bottom glass.
- If it overlaps the BOGEF circle, it can provide a hole through the backside glass
- Add a circle of half the minimum linewidth or larger in the centre of the cell (See illustration to the right)

Help layers/projection layers

- The help/projection layers provide means of visualizing the size of the resulting etched feature.
- Add circles to the layers [BOGEB] and [BOGEF] to illustrate the nominal dimensions of the edges of the etch. For dimensions, see the MultiMEMS design handbook or Assignment 6: Glass etching.

Challenge | What will the radius/diameter of the actual opening be? |

Minimum and maximum

- Add the help masks indicating the variation of the glass etch
- Layer: BOTG_TOLERANCE_ASSIST

Subassigment finished. Save the file. |  |

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STIMESI training on MULTIMEMS |
Last updated: June. 2009 24.06.2009