Definitions and explanations

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Hands-on design training for MultiMEMS
D. Lapadatu and P. Ohlckers

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| 8.4 Definitions and explanations

| 8.4.1 Anodic bonding

From http://www.mems-exchange.org/catalog/anodic_bonding/ :
'The substrates are bonded at elevated temperature (~400 degC) by placing and clamping the substrates between two metal electrodes. A high DC potential (up to >1kV) is applied between the electrodes creating an electrical field, which penetrates the substrates. One substrate is a glass that contains sodium ions, which at the elevated temperature are displaced from the bonding surface of the glass by the applied electrical field. The depletion of sodium ions near the surface of the glass makes the surface highly reactive with the silicon surface of the other substrate forming a solid chemical bond.'

| 8.4.2 Anisotropic etching of silicon

A password protected presentation of wet anisotropic etching of silicon can be found http://www.multimems.com/Training/Course_Materials/STIMESI/Module-Etching-Enc.pdf
Contact the training personnel to obtain the password.
See related topics and documents
http://www.multimems.com/Training/Course_Materials/STIMESI/Module-Etching-Enc.pdf

| 8.4.3 Venturi channel

See related topics and documents
http://en.wikipedia.org/wiki/Venturi_effect

| 8.4.4 Lateral diffusion

By the term lateral diffusion, it is meant that one must consider diffusion not only in the depth, but also laterally. This means that the implanted species will diffuse outside the extent of the mask opening, changing the size of the implanted region laterally.

| 8.4.5 Sheet resistance

See related topics and documents
http://en.wikipedia.org/wiki/Sheet_resistance

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STIMESI training on MULTIMEMS |
Last updated: June. 2009 24.06.2009